| abstract |
A method of manufacturing a component carrier, the method of providing an electrically insulating layer structure that has a front side and a rear side, the front side being covered with a first electrically conductive layer structure and the rear side being covered with a second electrically conductive layer structure a first opening process, in particular a first laser drilling, through the first electrically conductive layer structure and into the electrically insulating layer structure from the front, to thereby form a blind hole in the electrically insulating layer structure, and then performing a second opening process, in particular a second laser drilling , through the second electrically conductive layer structure and through the electrically insulating layer structure from the rear, in order to thereby expand the blind hole to a through opening, in particular a laser through opening with a substantially trapezoidal shape. |