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filingDate 1977-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1978-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1978-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4118523-A
titleOfInvention Production of semiconductor devices
abstract A method of forming very small diameter holes in a flexible substrate by coating both sides of substrate with metal layers; etching layers and substrate at places where holes required, removing small ring of the metal layers surrounding holes to remove any overhang of metal; and plating walls of holes and providing electrical conduction with said layers.
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