http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1154878-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d6051fbc446a23df668c7bd2a35c9b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-428 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 1980-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1983-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f27ddd9bdd1f59caccd4970d525889f |
| publicationDate | 1983-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-1154878-A |
| titleOfInvention | Heat shock resistant printed circuit board assemblies |
| abstract | ABSTRACT OF THE DISCLOSURE The heat shock resistance of plated through holes in printed circuit assemblies is significantly increased by using as the through hole plating a special multi-layered arrangement comprising at least two layers of an electrically conductive metal in combination with at least one intermediate layer of a different electrically conductive metal. In preferred embodiments, the through hole plating comprises at least two layers of a stressed metal together with at least one inter-mediate layer of a metal having a stress in counteraction to that of one or more of the other metal layers. These through hole platings are capable of exposure to conditions of heat shock, such as encountered during high temperature soldering, without developing cracks resulting in breaks in the conducting pathways and failures. |
| priorityDate | 1979-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.