http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I692284-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a162b65402a9a79580e3ae31dcbf3fa |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2016-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa51bdb6673241293c64d5ee712e890c |
| publicationDate | 2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I692284-B |
| titleOfInvention | Printed wiring board and its manufacturing method |
| abstract | [Problem] To provide a printed wiring board and a method of manufacturing the same, which does not require the use of special equipment, can facilitate the circulation of the plating solution into the through-hole, and can improve the filling efficiency of the conductor into the through-hole, and can ensure Connection reliability. A printed wiring board according to an aspect of the present invention includes an insulating resin 2, a copper plating 3a formed on the surface 2a side of the insulating resin 2, and a copper plating 3b formed on the back surface 2b side of the insulating resin 2. Moreover, the copper plating 3a and the copper plating 3b are electrically conducted by the copper plating 3c filled in the through-hole 8 which penetrates the insulating resin 2 from the front surface 2a side to the back surface 2b side. Furthermore, the through-hole 8 includes: a mortar-shaped portion 8a whose opening diameter gradually decreases from the front surface 2a side of the insulating resin 2 toward the back surface 2b side; and a cylindrical-shaped portion 8b on the bottom surface of the mortar-shaped portion 8a Connect. |
| priorityDate | 2015-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.