| abstract |
This acidic copper plating solution comprises a first additive made of a cationic polymer, at least one type of second additive selected from the group consisting of 2-mercapto-5-benzimidazole sulfonic acid, sodium 2-mercapto-5-benzimidazole sulfonate dihydrate, ethylene thiourea, and a partial 2-mercapto-5-benzimidazole sulfonate salt of poly(diallyldimethylammonium chloride), and a third additive made of a sulfur atom-containing organic compound, the acidic copper plating solution having a copper concentration of from 10 to 60 g/L, having a sulfuric acid concentration of from 10 to 200 g/L, including less than or equal to 90 mg/L chloride ions, and being capable of producing an acidic copper plated product having low thermal expansivity. |