| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b56b88668c3160a28353ed5d5e81e185 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
1992-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61161946af786678d875b1be0a1008e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2101b2d54384368e0f2acd964cc89ec3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b6a2c6aa5b5aa6b31df69536e61abea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_971208f962686f8926d11dbb8edc7093 |
| publicationDate |
1993-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
GB-2259812-A |
| titleOfInvention |
Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| abstract |
Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes (8) in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. The resin layer may comprise a high flowability layer and a low flowability layer. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided on its roughened surface with a resin layer soluble in an aqueous alkali solution and having flowability upon heating. <IMAGE> |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5874009-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6376053-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9161431-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5945258-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011000009-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1074236-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-82561-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0746189-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0742265-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6881293-B2 |
| priorityDate |
1991-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |