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filingDate 1986-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1987-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-8703773-A1
titleOfInvention Method for selectively removing adhesives from polyimide substrates
abstract Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).
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