http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012212867-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2012-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fafbf9431fdc00f30dc13ec936987bbf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f658afa79619e646e1226310268f9eb7 |
| publicationDate | 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012212867-A |
| titleOfInvention | Printed wiring board and manufacturing method thereof |
| abstract | The present invention provides a printed wiring board capable of sufficiently filling a resin without generating voids in a through hole having a large diameter and a through hole having a small diameter. A core substrate having a first surface and a second surface opposite to the first surface, the first substrate having a first through hole and a second through hole having a diameter larger than that of the first through hole; A first conductor formed on the first surface of the core substrate, a second conductor formed on the second surface of the core substrate, and the first through hole. A first through-hole conductor connecting the first conductor and the second conductor, and a second through-hole conductor formed inside the second through hole and connecting the first conductor and the second conductor; An inner wall of the first through hole and an inner wall of the second through hole are roughened, and the arithmetic average roughness Ra1 of the inner wall of the first through hole is the second through hole. A printed wiring board characterized by being smaller than the arithmetic average roughness Ra2 of the inner wall of the hole. [Selection] Figure 7 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014110293-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022091957-A1 |
| priorityDate | 2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.