| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59407f5848a6b4da6fbb781228da3c49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0d122d4b29f9aee0be49958d2294c8a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2016-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2fd230fcd9f70299569fee9d73acaa5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf392ddf21926294e621e09ec3c20772
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eef1abd8334452cbc8bc783459b0de34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45b6fc6b9484d11b34035af414a58b9b |
| publicationDate |
2018-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201815242-A |
| titleOfInvention |
Circuit board with thick copper line and manufacturing method thereof |
| abstract |
A method for fabricating a circuit board, comprising: providing a copper clad substrate comprising a support layer and a base copper layer; forming a first conductive trace pattern on a surface of the base copper layer; and forming the first conductive trace pattern on the surface of the base copper layer; Forming a first protective layer, the first protective layer further filling a gap between the first conductive line pattern and the base copper layer; peeling off the support layer; and plating a second conductive layer on the other surface of the base copper layer a circuit pattern; the portion of the base copper layer exposed by the first conductive line pattern and the second conductive line pattern is etched away to form the base copper layer into a base copper conductive line pattern, the base copper conductive line pattern, the first a conductive line pattern and the second conductive line pattern together form a conductive line; and a second protective layer is formed on a surface of the second conductive line pattern, the second protective layer further filling the second conductive line pattern and the first protection The gap between the layers. |
| priorityDate |
2016-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |