| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e9059c03350380e5577b50d44e3f4b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2015-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7524e7b44168f562cb51e3d0f6638246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f8dd9e24c4460e93709db48b6154f63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_942c8479a7b20962a582cf9f6d9ff1d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b481bbd69c4df5e5ce841199d4c21ff5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a537ccf9ec862e04728921ebbbeeb98 |
| publicationDate |
2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150084724-A |
| titleOfInvention |
Method for making printed circuit board |
| abstract |
The present invention relates to a method of manufacturing a printed circuit board, and a method of manufacturing a printed circuit board of the present invention includes: forming a first coating layer on a surface of a substrate with a conductive ink; A second coating layer forming step of forming a second coating layer with conductive ink on the other surface of the substrate; Forming a through hole by perforating the first coating layer, the substrate, and the second coating layer; And plating the inner wall surfaces of the first coating layer, the second coating layer, and the through holes to form a plating layer. Therefore, according to the present invention, it is possible to improve the precision and electrical characteristics of the circuit pattern realization through the conventional photolithography process and reduce the material cost, There is provided a method of manufacturing a printed circuit board capable of reducing process time and improving productivity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190012300-A |
| priorityDate |
2013-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |