| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_978fa8293149c4016df9758b8bd88f9c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 |
| filingDate |
1993-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1995-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28dd38a7cc7b84206b6e2afbb68f11e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98da83795f1293dbe57f0007f043aaa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e043b441fa95a2783a3d8a6dabbc70c6 |
| publicationDate |
1995-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5389270-A |
| titleOfInvention |
Composition and process for preparing a non-conductive substrate for electroplating |
| abstract |
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5738776-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0075932-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006102879-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5800739-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004191605-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004077733-A1 |
| priorityDate |
1993-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |