| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2000-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100741539-B1 |
| titleOfInvention |
Copper-clad board suitable for hole formation using a carbon dioxide gas laser, a method of forming a hole in the copper-clad board, and a printed wiring board comprising the copper-clad board |
| abstract |
Provided are a copper-clad board, a method of forming a hole in the copper-clad board, and a printed wiring board comprising the copper-clad board, wherein the copper-clad board is a surface layer of copper foil. At least one side of the thermosetting resin composition layer is placed on at least one outer layer of the thermosetting resin composition layer so that at least one side has a metal-treated layer having a high absorption rate for carbon dioxide gas laser energy so that a metal-treated layer is formed on the glossy side. It is obtained by laminating-forming the double-sided copper foil and the thermosetting resin composition layer under heat and pressure to form an alloy of a metal-treated layer with copper. |
| priorityDate |
1999-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |