Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e752c7f109e512673e3ab834ee5ff28 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09727 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
filingDate |
2020-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16bfde79737acbc427cda3075a7ce2f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d4215cbd77cedf9bf8ae02ae5b4d224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a658987dbceb1a6a8d4917167f4422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8a18d8cb62a1d6361899c04364f3906 |
publicationDate |
2020-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020253053-A1 |
titleOfInvention |
Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric |
abstract |
A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm. |
priorityDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |