Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D15-02 |
filingDate |
1996-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_471ef4df9898fe7986f918420070df0b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb0518b75c970e191ba845f215726b45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf57b863da8030ae2308869f7de99eef |
publicationDate |
1996-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0726337-A1 |
titleOfInvention |
Process for preparing a non-conductive substrate for electroplating |
abstract |
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has bee n previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10145750-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6984446-B2 |
priorityDate |
1995-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |