| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09104c2d8582bc77b74f5a127de76625 |
| publicationDate |
2013-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013084852-A |
| titleOfInvention |
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD |
| abstract |
A wiring board, a semiconductor device, and a manufacturing method of the wiring board that can cope with miniaturization of a wiring pattern are provided. A wiring board 1 penetrates a core substrate 10 in which a glass cloth 11 is impregnated with a thermosetting insulating resin and cured, and a first main surface 10a to a second main surface 10b of the core substrate 10. The through hole 10 </ b> X, the through electrode 20 filled in the through hole 10 </ b> X, and wiring layers 30 a and 30 b electrically connected through the through electrode 20 are included. In the core substrate 10, the glass cloth 11 is provided so that the density of the glass cloth 11 in the central portion in the thickness direction of the through hole 10X is higher than the density of the other part of the through hole 10X. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160102395-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015041245-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015084415-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102259485-B1 |
| priorityDate |
2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |