| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2014-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53447777a751c4c955b43d037a69b418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a9ecdbc219b4965cc644e84e83a8fd5 |
| publicationDate |
2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160102395-A |
| titleOfInvention |
Manufacturing method for circuit board |
| abstract |
And the electrical connection by the hole portion formed in the insulating layer can be more reliably performed. (A) an insulating layer 20 having a first main surface 20a and a second main surface 20b opposite to the first main surface; (B) a step of forming a metal layer 42 bonded to the molecular bonding layer; and (C) a step of irradiating a laser beam onto the molecular bonding layer 30, (E) forming a conductor layer (44); forming a hole (26) through the metal layer, the molecular bonding layer and the insulating layer; , And a step (F) of forming a wiring layer (40). |
| priorityDate |
2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |