| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db5bb4fa8889ba9e7cbbb432a67b2e23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3750b4a53c3291b98c8f0936468e986 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0353 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12 |
| filingDate |
2007-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87a67f77007ae5b54dc154668a6fd3d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85b91df8b11ccd6cffdff7d53e7d3131 |
| publicationDate |
2009-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009136725-A1 |
| titleOfInvention |
Process for producing copper wiring polyimide film, and copper wiring polyimide film |
| abstract |
There is disclosed a copper wiring polyimide film having wiring with ultra fine pitch and excellent in the linearity. The copper wiring polyimide film is produced by a process for producing a copper wiring polyimide film having a 20 to 45 μm-pitch copper wiring part by a semi-additive method using a copper foil laminated polyimide film with carrier. The process comprises (a) a step of providing a copper foil laminated film comprising a copper foil having a film side surface roughness Rz of not more than 1.0 μm and a thickness in the range of 0.5 to 2 μm laminated on a surface of a polyimide film, (b) a step of forming a plating resist pattern layer in which a wiring pattern having 20 to 45 μm pitch can be formed on the upper surface of the copper foil, (c) a step of conducting copper plating on the copper foil part exposed from the resist, (d) a step of removing the plating resist, and (e) a step of removing the copper foil exposed on the plating resist-removed part to expose a polyimide film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10952329-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9891523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11476228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110475909-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015382473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10461234-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022191402-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012023902-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014100702-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8828245-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11018288-B2 |
| priorityDate |
2006-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |