http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004042579-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K79-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-32 |
| filingDate | 2002-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e23598053bd89274426200c3840a69a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117503a07a6eecf0c0708052601c1475 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b57ba0d12884b7d358d1cccdef766dc7 |
| publicationDate | 2004-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004042579-A |
| titleOfInvention | Copper clad laminate and method for producing the same |
| abstract | Provided is a copper-clad laminate suitable as a substrate material of all-polyimide, which is capable of coping with fine patterning, which is impossible with a conventionally known copper-clad laminate for a substrate. . An ultra-thin copper foil with a heat-resistant carrier and a thermo-compressible multilayer polyimide film comprising a thermo-compressible aromatic polyimide layer and a highly heat-resistant aromatic polyimide layer are thermo-compressed under pressure-cooled and laminated. A copper-clad laminate wherein the adhesive strength between the copper foil and the thermocompression-bondable multilayer polyimide film is 0.7 N / mm or more, and the peel strength between the carrier and the copper foil is 0.2 N / mm or less; The above-mentioned method for producing a copper clad laminate in which thermocompression bonding is performed at a temperature not lower than the glass transition temperature of the thermocompression-bonding aromatic polyimide and not higher than 400 ° C. under cooling by a belt press and cooling. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4516769-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005254632-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007216687-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007203505-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7459518-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009136725-A1 |
| priorityDate | 2002-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.