http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007216687-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
filingDate | 2007-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117503a07a6eecf0c0708052601c1475 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b57ba0d12884b7d358d1cccdef766dc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e23598053bd89274426200c3840a69a0 |
publicationDate | 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007216687-A |
titleOfInvention | Copper-clad laminate manufacturing method, electronic component substrate manufacturing method |
abstract | PROBLEM TO BE SOLVED: To provide a copper clad laminate suitable as an all polyimide substrate material for enabling to cope with fine patterning which is impossible with a conventionally known copper clad laminate for a substrate. . SOLUTION: An ultrathin copper foil with a heat-resistant carrier, a thermocompression-bonding aromatic polyimide layer, and a thermocompression-bonding multi-layer polyimide film composed of a high-heat-resistance aromatic polyimide layer are laminated under pressure-compression-cooling under pressure. A copper clad laminate in which the adhesive strength between the copper foil and the thermocompression-bonding multilayer polyimide film is 0.7 N / mm or more and the peel strength between the carrier and the copper foil is 0.2 N / mm or less, and double The manufacturing method of the said copper clad laminated board laminated | stacked by thermocompression-cooling at the temperature of 400 degreeC or less above the glass transition temperature of a thermocompression-bonding aromatic polyimide under pressure with a belt press. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113225916-A |
priorityDate | 2007-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.