http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007216687-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
filingDate 2007-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117503a07a6eecf0c0708052601c1475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b57ba0d12884b7d358d1cccdef766dc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e23598053bd89274426200c3840a69a0
publicationDate 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007216687-A
titleOfInvention Copper-clad laminate manufacturing method, electronic component substrate manufacturing method
abstract PROBLEM TO BE SOLVED: To provide a copper clad laminate suitable as an all polyimide substrate material for enabling to cope with fine patterning which is impossible with a conventionally known copper clad laminate for a substrate. . SOLUTION: An ultrathin copper foil with a heat-resistant carrier, a thermocompression-bonding aromatic polyimide layer, and a thermocompression-bonding multi-layer polyimide film composed of a high-heat-resistance aromatic polyimide layer are laminated under pressure-compression-cooling under pressure. A copper clad laminate in which the adhesive strength between the copper foil and the thermocompression-bonding multilayer polyimide film is 0.7 N / mm or more and the peel strength between the carrier and the copper foil is 0.2 N / mm or less, and double The manufacturing method of the said copper clad laminated board laminated | stacked by thermocompression-cooling at the temperature of 400 degreeC or less above the glass transition temperature of a thermocompression-bonding aromatic polyimide under pressure with a belt press. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113225916-A
priorityDate 2007-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0718401-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11317574-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004042579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003340962-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002144476-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75494
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419513230
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424388872
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414882160
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75908
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423037501
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419515750
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15522
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546558
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19935321
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69145
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15617
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419516895
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID75498
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14121182
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084646
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421071116
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID536770
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69591
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415741673
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424594717
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14736746
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414972214
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69149
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID74574
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414881719
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID66342
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415733818
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424622899
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415741734
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14398587
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409245044
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414885082
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8764
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425966335
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8289
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415754414
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410550496
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7579
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426209432
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414877992
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12703
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415756990
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22630411
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410479465
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424504677
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17369
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19012
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7540
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17201

Total number of triples: 70.