http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060069798-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2006-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd4611456f1baab9e1f971fe64f294a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bf8b6ca0c0e1d07642332d55ce4826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e542ef5793267873b4dae4e78404d224 |
| publicationDate | 2006-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060069798-A |
| titleOfInvention | Method for manufacturing through-hole by laser, copper laminated plate suitable for hole production and auxiliary material for hole production |
| abstract | The present invention provides a method for producing a small diameter through hole having high reliability with respect to the hole wall at high speed by energy of a carbon dioxide gas laser without forming any hole in a copper foil in advance, and using the same. Auxiliary material to be prepared, the method for producing the metal compound powder, carbon powder and at least one powder selected from the group consisting of a metal powder having a melting point of at least 900 ℃ and a binding energy of at least 300 KJ / mol 3 to 3 to. A coating or sheet of organic substance containing 97% by volume is formed or arranged on at least one copper foil surface to be irradiated with a carbon dioxide gas laser, and a pulse necessary to form the through hole. irradiating the surface with a pulse of carbon dioxide gas laser; In addition, the auxiliary material used when the through hole is manufactured in a copper-clad laminate with a carbon dioxide gas laser is a metal powder, a carbon powder and a metal powder having a melting point of at least 900 ° C. and a binding energy of at least 300 KJ / mol. At least one powder selected from the group consisting of is characterized in that the coating or sheet of the organic material containing 3 to 97% by volume.n n n n Printed Circuit Boards, Lasers, Carbon Dioxide, Auxiliary Materials, Backup Sheets |
| priorityDate | 1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.