| abstract |
The present invention provides a method for producing a laminate having excellent heat resistance and capable of forming a small diameter via hole. SOLUTION: A step of obtaining a curable resin composition layer with a support for forming a curable resin composition layer on a support, and laminating the substrate on the curable resin composition layer forming surface side. , A step of obtaining a pre-cured composite with support, a first heating to obtain a cured composite with a support as a cured resin layer, and drilling from the support side of the cured composite with support A step of forming a via hole, a step of obtaining a cured composite comprising a substrate and a cured resin layer by peeling the support from the cured composite with a support, a step of performing a second heating on the cured composite, and a via hole. A step of removing the resin residue inside, and a step of forming a conductor layer on the inner wall surface of the via hole and the cured resin layer. Combination of electrolytic plating and electrolytic plating Method for producing a laminate that performed by. [Selection figure] None |