| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d78851c3f53afc6e0e9e5fc8c80a15 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0716
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
1986-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1990-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c96f10bf00c5e30f2229e11769ac0f54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_293038726e70bb06a2d3c898e669f7f6 |
| publicationDate |
1990-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4891069-A |
| titleOfInvention |
Composition for the electrolytic coating of circuit boards without an electroless metal coating |
| abstract |
A process and composition are disclosed for directly electrometallizing a non-conductive substrate such as the non conductive surfaces of a circuit board and to directly effect through hole plating and/or form circuits on the boards without employing an electroless metal coating. A process and composition is also described for depositing metals on a non-conductive substrate by using the reductive capacity of hydrogen in the presence of a metal catalyst on the substrate. The metal catalyst is combined with hydrogen that is generated electrolytically from a protic bath. The metal catalyst combined with hydrogen is contacted with a metal salt. The metal salt may be combined with the protic bath so that the hydrogen that is generated electrolytically combines with the metal catalyst and the metal salt is converted to a metal coating on the substrate. |
| isCitedBy |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004058071-A1 |
| priorityDate |
1986-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |