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filingDate 2008-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008230512-A1
titleOfInvention Printed Circuit Board and Method for Processing Printed Circuit Board
abstract The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. n There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.
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