| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e752c7f109e512673e3ab834ee5ff28 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-116 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d18c5e0e550c5683299d1d49b9f1e87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76beb8d600514bcfc42a9dd131818168 |
| publicationDate |
2020-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-111511105-A |
| titleOfInvention |
Component carrier with vias filled with additional plating and bridge structures |
| abstract |
A component carrier (100) and a method of manufacturing the component carrier (100) are provided. The component carrier includes: an electrically insulating layer structure (102) having a first major surface (104) and a second major surface (106); a through hole (108) extending through the electrically insulating layer structure (102) between the first major surface (104) and the second major surface (106) and having a first tapered portion (114) extending from the first major surface (104) and a first tapered portion (114) extending from the second major surface (106) a second tapered portion (116); a first plating structure (180) on at least a portion of a sidewall (112) of the electrically insulating layer structure (102), the sidewall (112) defining a through hole (108); and a second plating structure (182) formed separately from the first plating structure (180) and disposed on the first plating structure, wherein the second plating structure The structure (182) includes a conductive bridge structure (110) connecting opposing sidewalls (112). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930033-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930033-B |
| priorityDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |