http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2162905-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00 |
| filingDate | 1994-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad4f6ebf458df22a87fb73a1d7d46392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2ef01926bb73a695f654effab434264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6273d65977f19836761e05d6139456a0 |
| publicationDate | 1994-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-2162905-A1 |
| titleOfInvention | Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
| abstract | The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20 % by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10 % by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of a anionic despersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111647901-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111647901-A |
| priorityDate | 1993-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.