| abstract |
Comprise a copper electroplating solution for compound and the aliphatics semialdehyde with-X-S-Y-structure, wherein X and Y is selected from the atom in the group that is made up of hydrogen, carbon, sulphur, nitrogen and oxygen independently of each other, and X with Y only has when they are carbon atoms just identical.By using this copper electroplating solution, good through hole of filling can be formed and do not worsen the pattern of plating. |