| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2007-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f15aa67a7e04f15d2ac44e8bc6022971
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1a9f6c81fd8d904da2396eb8dc6dda5 |
| publicationDate |
2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200808145-A |
| titleOfInvention |
Process for producing copper wiring polyimide film and copper wiring polyimide film |
| abstract |
This invention discloses a copper wiring polyimide film of extremely small pitch and excellent linearity. This invention provides a process for producing the copper wiring polyimide film, in which copper wiring polyimide film including a copper wiring section having a pitch of 20 to 45 μm is produced using a copper foil laminated polyimide film with carrier by means of a semi-additive method. This process includes the steps of: (a) preparing a copper foil laminated film by laminating, on a surface of a polyimide film, a copper foil having a surface roughness Rz of 1.0 μm or less and a thickness of 0.5 μm to 2 μm on a film side surface thereof; (b) forming, on an upper surface of the copper foil, a layer of plating resist pattern that can form a wiring pattern having a pitch of 20 to 45 μm; (c) Conducting copper plating on a portion of the copper foil exposed from the resist; (d) removing the plated resist; (e) removing the copper foil exposed from the part where the plated resist has been removed so as to expose the polyimide film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I613940-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I449482-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I449481-B |
| priorityDate |
2006-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |