| abstract |
Component carrier (100), which has a stack (145) that has at least one electrically conductive layer structure (152, 161) and / or at least one electrically insulating layer structure (102), a tapered blind hole (113) that is made in the stack (145 ) and an electrically conductive plating layer (146) extending along at least a portion of a horizontal surface (143) of the stack (145) outside of the blind hole (113) and along at least a portion of a surface of the blind hole (113), A minimum thickness (d3) of the plating layer (146) on a bottom (151) of the blind hole (113) is at least 8 μm. |