http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05239660-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_658af5c97b790d116cecbf317214b247 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0716 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 1992-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2e1210f8b3c4632bd33e9add2aefe4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bb20b40ec9d53891df133395b2dc51a |
| publicationDate | 1993-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05239660-A |
| titleOfInvention | How to make plastics substrates electrically conductive for metal plating |
| abstract | (57) [Summary] (Modified) [Constitution] A direct metallization process in which a plastics substrate (base) is subjected to electrolytic plating without pretreatment as an electroless plating, at a raised temperature By using the composition of the post-activator composition thus prepared, the surface of the substrate whose surface has been pre-activated is further activated, and the two-step activation treatment in the pre-stage and the post-stage is performed to obtain a plastics material. The latter-stage activator, which gives excellent conductivity to the surface of the substrate, is an alkaline solution containing an effective amount of metal ions that undergo a disproportionation reaction or an alkaline solution containing metal ions such as Cu +2 . It is either. [Effect] It becomes possible to make the non-conductive plastic substrate and the substrate suitable for the electrolytic plating treatment by the activation treatment. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07302965-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002146589-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112007001651-T5 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112007001651-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010526205-A |
| priorityDate | 1991-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.