Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e407497b381db83137e126cb3e0b079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
filingDate |
2006-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb97530b9fcb4d91e818284b868efcf7 |
publicationDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8992756-B2 |
titleOfInvention |
Direct plating method and solution for palladium conductor layer formation |
abstract |
A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper. |
priorityDate |
2006-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |