| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ac17835c97e6c72213815ca74845386 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
1986-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1993-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89aac2fa9fde9f6c83de3194fd9c1ab4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaf65f565a0be3eec4bb55ea4cbef5c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb467aee2667ad7972127287fcedda4f |
| publicationDate |
1993-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-930010060-B1 |
| titleOfInvention |
Manufacturing method of printed circuit board having solder plating circuit and through hole |
| abstract |
No content. |
| priorityDate |
1985-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |