| abstract |
Disclosed is a substrate for a printed wiring board, which has no size limit since a vacuum facility is not required for the production of the same. The substrate for a printed wiring board does not use an organic adhesive and comprises a sufficiently thin conductive layer (copper foil layer). Also disclosed are a printed wiring board, a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. Specifically disclosed is a substrate (1) for a printed wiring board, which comprises an insulating base (11), a first conductive layer (12) that is arranged on the insulating base (11), and a second conductive layer (13) that is arranged on the first conductive layer (12). The first conductive layer (12) is configured as a coating layer of a conductive ink that contains metal particles, and the second conductive layer (13) is configured as a plating layer. |