| abstract |
(Project) To provide a composition for forming a conductive film for forming a conductive film having low resistance and excellent adhesion to a substrate, and to provide a conductive film, a method for manufacturing a plating film, a plating film, and an electronic device. (Solution Means) The composition for forming a conductive film used in the formation of the conductive film is (A) a metal salt containing at least one metal selected from the group consisting of Ni, Pd, Pt, Cu, Ag and Au, and at least metal particles. It prepares using one side and (B) a metaloxane compound. A coating film is formed on a substrate using the composition for forming a conductive film, heated to 250° C. or lower in the atmosphere or in a non-oxidizing atmosphere, and a conductive film is formed on the substrate to manufacture a wiring board. Further, using the composition for forming a conductive film, a coating film is formed on the transparent substrate 22 on which the first detection electrode 23 and the second detection electrode 24 are formed, and the coating film is heated to form the lead wiring 31 . ) to manufacture the touch panel 21 . |