| abstract |
The invention discloses a low copper salt weak alkaline electronic copper electroplating solution and its application, which is composed of deionized water, inorganic divalent copper salt, complexing agent, pH buffering agent and leveling agent. The invention uses hydroxyl and/or carboxyl-containing organic compounds as divalent copper ion complexing agents, combined with pH buffering agents and leveling agents of specific composition and content, to achieve dense filling of PCB blind holes, and has the advantages of simple composition, low copper salt concentration, weak Alkaline, low corrosion, easy to control and so on. |