| abstract |
Provided is a copper foil with a carrier having good fine circuit formability. In order to further improve the fine circuit formability and reduce the time for flash etching, a carrier, an intermediate layer, and an ultrathin copper layer are provided in this order to reduce the thickness range of a layer for forming a circuit. A copper foil with a carrier, which has a protrusion peak height Spk of 0.059 to 0.470 μm based on ISO25178 measured by a laser microscope on the surface of the ultrathin copper layer of the copper foil with a carrier. . The actual volume Vmp of the peak is 0.003 to 0.024 μm 3 / μm 2 , and the ratio Sp / Spk between the maximum peak height Sp and the protruding peak height Spk is 3.271 to 10.3939. Copper foil with carrier. [Selection] Figure 4 |