http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0830054-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7ad58d3c0b071069a8ee0cb8c8ba2e8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 1997-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f8555bccdbd2d4fed9e5261ae549b1d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84fce944ac6470dbf172abdf91e02951 |
| publicationDate | 1998-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0830054-A1 |
| titleOfInvention | Process for manufacturing rigid and flexible circuits |
| abstract | a) die Oberflächen der Trägermaterialien einschließlich vorhandener Bohrlöcher mit einem Primer und einem leitenden Polymer beschichtet, das Bindemittel enthalten kann, b) ein Galvanoresist in Form des negativen Leiterbahnenbildes aufbringt, c) eine galvanische Metallisierung der von Galvanoresist freigehaltenen Oberfläche einschließlich vorhandener Bohrlöcher in Form des positiven Leiterbahnenbildes durchführt, d) den Galvanoresist entfernt und e) das unter dem Galvanoresist gewesene leitende Polymer entfernt oder in eine nicht leitfähige Form überführt. Rigid or flexible circuits made of electrically conductive interconnects can be produced on flexible or rigid, non-conductive substrates by: a) the surfaces of the carrier materials, including existing boreholes, are coated with a primer and a conductive polymer which may contain binders, b) a galvanoresist is applied in the form of the negative conductor pattern, c) performing a galvanic metallization of the surface kept free of galvanoresist, including existing boreholes in the form of the positive interconnect pattern, d) removing the galvanoresist and e) the conductive polymer that was under the galvanoresist is removed or converted into a non-conductive form. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015169495-A1 |
| priorityDate | 1996-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.