Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eff6e4be293d3bd416d3041dd1cb5d7d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1658 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F292-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 |
filingDate |
2006-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bedc6d6501d0d6a4ab8cea8fd435b4e |
publicationDate |
2007-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2007055223-A1 |
titleOfInvention |
Method for forming metal film and method for forming metal pattern |
abstract |
Disclosed is a method for forming a metal film which is characterized by comprising a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt and is chemically bonded to the substrate directly; a step (a2) for providing the polymer layer with a metal ion or a metal salt; a step (a3) for forming a conductive layer having a surface resistivity of 10-100 kΩ/□ by reducing the metal ion or the metal salt; and a step (a4) for forming a conductive layer having a surface resistivity of 1 × 10-1 Ω/□ or less by electroplating. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010243461-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008294077-A |
priorityDate |
2005-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |