| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7194097fad15f8d107986fa0f8fdbca4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2012-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8a5281c73befd09baf868568a1dd3d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_528c51236c0f47606ad8f7cce9010cdd |
| publicationDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-112012000993-T5 |
| titleOfInvention |
Non-invasive method for producing continuous conductive tracks on the surfaces of a non-conductive substrate |
| abstract |
A harmless method of forming a continuous trace on a nonconductive substrate may begin by applying a base layer of a metal on a surface of a nonconductive substrate. A circuit pattern may be fabricated in the metal base layer based on a circuit design. The metal base layer comprising the circuit pattern may be physically separated from the remainder of the metal base layer on the non-conductive substrate. The area of the surface of the non-conductive substrate that encloses circuit pattern may be referred to as a coating area. The remaining surface of the non-conductive substrate may be referred to as a non-coated area. A first metal layer may be added to the metal base layer. A second metal layer may be added on the first metal layer of the coating area. The second metal layer can be electrically conductive and its formation on the first metal layer of the area without coating can be prevented. |
| priorityDate |
2011-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |