| abstract |
The described embodiment is directed to an Application Specific Electronics Packaging ("ASEP") system, which is a reel-to-reel system in contrast to the "batch" And enables the manufacture of additional products using a reel-to-reel (68a, 68b) manufacturing process. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memories, impedance controllers, and multi-layer functionalities directly into the product. |