http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130142936-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1275 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2013-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f5c685bc1fca6bddecd5f4fd41a7d51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_196629b00c7b24919cebc1074fe26c3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4773898f6b095f7310f2f37b7b16e401 |
| publicationDate | 2013-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20130142936-A |
| titleOfInvention | Circuit formation method of a printed wiring board, a thermosetting resin composition, and a printed wiring board |
| abstract | It does not require the plating pretreatment process and the polishing process of the metal excessively formed by the plating film or the conductive coating film, so that a fine circuit can be formed, and the workability of the insulating resin layer by laser irradiation, or the adhesion between the insulating resin layer and the circuit film The circuit forming method of a printed wiring board, a thermosetting resin composition, and a printed wiring board are provided. A recess structure forming step of forming an recess structure by removing the insulation resin layer by irradiating an ultraviolet laser having a pulse width of nanosecond order to the insulation resin layer having ultraviolet absorptivity on the metal-clad laminate, and forming the recess structure It is a circuit formation method of the printed wiring board which has a dispersion liquid application process which apply | coats the dispersion liquid containing metal nanoparticle by the inkjet method in the recess structure formed by the process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108471675-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180016611-A |
| priorityDate | 2012-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 125.