http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102381835-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 |
| filingDate | 2018-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102381835-B1 |
| titleOfInvention | Anode for electrolytic copper plating and electrolytic copper plating apparatus using same |
| abstract | An object of the present invention is to provide an anode for electrolytic copper plating capable of improving plating properties such as plating accelerating property and via filling property without complicating the device structure, and an electrolytic copper plating device using the same. In order to achieve this object, an anode disposed in an electrolytic treatment tank in which an electrolytic copper plating solution is stored, wherein the electrolytic copper plating solution is an acidic electrolytic copper plating solution containing a disulfide compound, and the anode electrically connects a soluble copper anode and an insoluble anode An anode for electrolytic copper plating characterized in that it is provided in one state is adopted. |
| priorityDate | 2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.