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filingDate 2010-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013509718-A
titleOfInvention Metal adhesion
abstract The systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on the conductive backplane. In some embodiments, the voltage switchable dielectric material includes a plurality of regions with different characteristic voltages for deposition. Some embodiments can include the use of contact masks that include and can be removed. Certain embodiments include electrografts. Some embodiments include an intermediate layer disposed between the two layers. [Selection] Figure 8
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014187636-A
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