| abstract |
A metal film forming method capable of forming a metal film having excellent adhesion to a substrate, sufficient conductivity, and small irregularities at the interface with the substrate by a simple method, and an etching step are performed. A metal that can form a fine metal pattern without any problem, has excellent adhesion to the substrate, has sufficient conductivity, and has a small unevenness at the interface with the substrate by a simple method. It is to provide a pattern forming method. (A1) A step of providing on a substrate a polymer layer made of a polymer having a functional group that interacts with a metal ion or a metal salt and directly chemically bonding to the substrate; and (a2) a metal ion on the polymer layer. Or a step of applying a metal salt, (a3) a step of reducing a metal ion or metal salt to form a conductive layer having a surface resistivity of 10 to 100 kΩ / □, and (a4) a surface resistance by electroplating. And a step of forming a conductive layer having a rate of 1 × 10 −1 Ω / □ or less. [Selection figure] None |