| abstract |
An object of the present invention is to provide a method and composition for selectively modifying the surface of a substrate that can easily, selectively and with high density modify a surface region containing silicon. The present invention provides a process for preparing a substrate having a first region containing silicon on a surface layer, and a first polymer having a group including a first functional group bonding to silicon on the surface of the substrate at the terminal of the main chain or side chain, and It is a selective modification method of the surface of a base material provided with the process of coating the composition containing a solvent, and the process of heating the coating film formed by the said coating process. The first region preferably includes silicon oxide, silicon nitride or silicon oxide nitride. The base material is a region other than the first region and further includes a second region containing a metal, and after the heating step, a step of removing a portion of the coating film formed on the second region with a rinse solution. it is preferable |