http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201006337-A

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2009-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37e0ec6b0d90ddad0b922b440d918a34
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publicationDate 2010-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201006337-A
titleOfInvention Printing wiring cardinal plate and method for producing the same
abstract The invention provides a printing wiring cardinal plate with high insulation reliability and corrosion resistance and method for producing the same, namely the conductor wiring is formed with high etching, when etching is performed by ferric chloride solution or hydrochloric acid solution of copper chloride, residual etching draff with ingredients of the base metal layer between the conductor wirings are few, when high voltage is exerted among the conductor wirings. On at least one surface of the insulating resin film A, a metallic layer B with nickel, or nickel-chromium alloy containing nickel above 70 quality percentage and chromium below 15 quality percentage is stacked in series without an adhesive agent; a metallic layer C made of alloy containing chromium over 15 weight percentage, unnecessary part of a metal membrane composed by copper tunica layer D with thickness 10 nm to 35 Mum, chemical etching processing is adopted for selective removal, and then the printing wiring cardinal plate of conductor wirings is formed.
priorityDate 2008-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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