| abstract |
A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 Ω/sqaure. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10 6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7). n A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards. |