| abstract |
Metal-clad laminates in which the metal coating of the laminate is only from about 1 micron to about 20 microns in thickness are prepared by depositing a copper coating on a substrate which has been treated with a release agent, treating the upper side of the metal layer to improve the adhesive properties of the metal, thereafter bonding the metal coating to a laminate and removing the substrate to thus prepare the desired metal-clad laminate. |