| abstract |
A composite foil comprising a conductive carrier,nan organic release layer coating a surface of thenconductive carrier, and a conductive particle layernformed on the organic release layer. A process fornproducing a composite foil, comprising the steps ofnforming an organic release layer on a surface of anconductive carrier, and electrodepositing a conductivenparticle layer on the organic release layer. A copper-cladnlaminate comprising the above composite foilnlaminated to a base material. A copper-clad laminatencomprising the above composite foil laminated to a basenmaterial, having only the conductive carrier removedntherefrom. Thus, there are provided a composite foilnfor printed wiring board production from which a copper-cladnlaminate enabling laser perforating without formingnburrs even at lower laser power and further enablingnforming fine-pitch wiring patterns can be produced, anprocess for producing the composite foil and a copper-cladnlaminate produced therefrom. |