| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-254
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-935 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25C1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D9-02 |
| filingDate |
2000-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7a4193afed4b33af6fce46ca6d72afe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_283085b304dd8f682a4eb8e9cddec69c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3749ef4fdfcaffd25f4a36a7eaad26c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bea4ebd61d6c7b33628fe023bcf8a0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00ceff11b0ea0ce2f2f394d3f6d25877 |
| publicationDate |
2003-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6610418-B1 |
| titleOfInvention |
Electolytic copper foil with carrier foil and method for manufacturing the same |
| abstract |
The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004188263-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10212814-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004170858-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112853408-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7217464-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112853408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9992874-B2 |
| priorityDate |
1999-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |