| abstract |
The present invention provides a copper foil with a carrier having excellent microcircuit formation properties. The copper foil with carrier of the present invention is provided with a carrier, an intermediate layer and an ultra-thin copper layer in this order, and the maximum peak height Sp according to ISO 25178 measured by a laser microscope on the side surface of the ultra-thin copper layer of the carrier copper foil is 0.193~ 3.082 μm. |